METHOD FOR ENCAPSULATING BALL-GRID-ARRAY SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for encapsulating a ball-grid-array(BGA) semiconductor package is provided to shorten the time taken for a whole manufacturing process, by preventing flash from generating in an encapsulating process, and by performing an encapsulation regarding a plurality of units at a time. CONSTITUTION: A method for encapsulating a ball-grid-array(BGA) semiconductor package comprises the steps of: performing a wiring process to connect multi-layer wiring on a printed circuit board(PCB) with a semiconductor chip with a piece of wire; sticking a hetero adhesive tape having a cavity of a predetermined size, in the center, to the upper portion of the PCB; surrounding the entire semiconductor package including the hetero adhesive tape with a mould; injecting liquid epoxy through a through hole of the mould, so that the upper portion of the PCB exposed through the cavity is covered with the liquid epoxy; and eliminating the mould and hetero adhesive tape.