| 摘要 |
PROBLEM TO BE SOLVED: To obtain a fixing method of heat sink in which a heat sink abuts surely against a heating member even under different dimensional conditions. SOLUTION: A circuit board 7 mounting a semiconductor element 5 is secured in a container 9 and fixed with an upper surface plate 11. Subsequently, a heat sink 1 is screwed into the screw hole 15 of the container 9 from the outside thereof until the lower end part 1a thereof abuts against the upper surface of the semiconductor element 5. According to the method, the lower end part 1a of the heat sink 1 can abut surely against the upper surface of the semiconductor element 5.
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