| 摘要 |
PROBLEM TO BE SOLVED: To more improve soldering quality. SOLUTION: Fused solder is spouted upward in a jet solder vessel. A chuck mechanism clamps a substrate 4 with pawls 17, 26. A robot arm carries the chuck mechanism in the state that the substrate 4 is clamped with the chuck mechanism, and brings the substrate 4 into contact with solder jet 40 of the vessel. In the chuck mechanism, scraper paws 39 are stretched all over the whole front region in the carrying direction of the substrate 4. When the substrate 4 is brought into contact with the solder jet 40, the scraper pawls 39 come into contact with solder liquid surface in the jet solder vessel in the front of carrying direction of the substrate 4, and the jet solder eliminates an oxide coating film 41 formed on the solder liquid surface. The substrate 4 is carried in the state that solder flows FL2, FL3 toward end portions A1, A2 of the substrate which turn to the sides in the carrying direction, from the carrying direction side of the substrate 4 are formed.
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