| 摘要 |
PROBLEM TO BE SOLVED: To facilitate removal of a reaction product generated as a result of microwave plasma etching, and also to flatten an interlayer film formed on a wiring to facilitate multi-layered wiring, by reducing generation of an improper fishbone and by processing it into a taper shape. SOLUTION: A step of microwave-etching a metallic film 2 includes a first etching step of etching the metallic film 2 with use of a ternary mixed gas of BCl3, Cl2 and CH2F2 and a subsequent second etching step of etching the metallic film 2 with use of a binary mixed gas of BCl3 and Cl2.
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