| 摘要 |
PROBLEM TO BE SOLVED: To improve the CCD recognition by heating and holding a substrate over a specified substrate surface temp. for several seconds or more and adhering a Cu circuit with a thermosetting resin. SOLUTION: A Cu circuit on the surface of a substrate is treated with an acid water soln. contg. carboxylic acid, Cu ions and a Cu ion chelating agent to rough the Cu circuit surface, the rough-surfaced Cu circuit is washed with water, the substrate is heated and the substrate surface temp. held at 110 deg.C or higher for 5 sec or more, the Cu circuit is adhered with a thermosetting resin such as epoxy resins, phenol resins, polyimide resins, unsat. polyester resins and polyphenylene ether resins to produce. Thus it is possible to obtain an inner-circuit-contg. laminate board superior in acid resistance and solder heat resistance. |
