| 摘要 |
PROBLEM TO BE SOLVED: To get a highly reliable semiconductor device at high yield. SOLUTION: As shown in (a), the chip mount of a board 4 is supplied with liquid-form sealing resin 8a of such quantity that it does not spread to the electrode 2 and the gold bump 5 of a semiconductor chip 1 when the semiconductor chip 1 is mounted on the board 4, and also silver paste 3 being conductive paste is transcribed to the tip of the gold bump 5. Then, as shown in (b), the semiconductor chip 1 is mounted on the board 4 so that the gold bump 5 may be laid on the conductor pattern 4, and the gold bump 5 and the conductor pattern 6 are joined with each other by pressurization and heating. Then, as shown in (c), the gap between the semiconductor chip 1 and the board 4 is sealed with liquid-form sealing resin 8b, whereby the periphery of the junction between the gold bump 5 and the conductor pattern 6 is protected. |
