| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a deflection caused by the difference in thermal expansion coefficient between a resin and metal by specifying the length of a side of a semiconductor package, and the ratio between the thickness of an aluminum base, and that of a resin substrate, and specifying a linear expansion coefficient of the aluminum base at a specified temperature for setting a specific condition. SOLUTION: The thickness of a metal base 1 and that of a resin substrate 3 are so set that the entire thickness is thinner as possible depending on, with the metal base 1 being an aluminum base, such range as satisfies Y>=0.04X+0.92 (the length of a side of a semiconductor package is X (mm), the ratio between the thickness of the metal base 1 and that of the resin substrate 3 is Y, while a linear expansion coefficient of the metal base 1 is 24μm/ deg.C or less at 20 deg.C), such application as whether the metal base 1 functions as a structure body or as a heat sink, and conditions such as voltage and operation frequency. Thus, deformation of the semiconductor package is prevented.</p> |
