| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit substrate inspecting method capable of contriving to shorten the inspection time. SOLUTION: In the circuit substrate inspecting method which inspects success or fail of a circuit substrate by insulation-inspection based on a conduction state between conductor patterns formed in the circuit substrate to be inspected, capacities between each conductor pattern and capacity measuring means arranged at a predetermined position with respect to the circuit substrate are measured, respectively (step 21), and an insulation inspection is made with respect to between conductor patterns in which the measured measurement capacities approximate each other (step 30). Thus, it is possible to squeeze the conductor pattern as a conduction insulation inspection object, and to be able to end the inspection in a short time.
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