发明名称 SHIELDING MATERIAL
摘要 PROBLEM TO BE SOLVED: To improve the weather-resistance of a copper deposition layer, by forming a highly weather-resistant metallic layer on the copper deposition layer after forming the copper deposition layer on a macromolecular film substrate. SOLUTION: In a metal depositing on a film substrate, a PET(polyethylene terephthalate) film 20 set to a winding-out shaft 19 provided in an upper chamber 12 is fed via a free-roll 21 to the outer surface of a deposition drum 22 to make it travel in a rotational direction (A) adhesively to the outer surface of the deposition drum 22. Then, a second kind oxygen-free copper 27 stored in a depositing-source vessel 26 present on the side of a lower chamber 13 and opposed to the deposition drum 22 is stuck and deposited on the PET film 20 to form on it a copper deposition layer. Thereafter, a nickel 31 stored in a depositing-source vessel 30 is deposited on the copper deposition layer of the PET film 20 to form on it a nickel deposition layer as a highly weather- resistant layer.
申请公布号 JP2000216591(A) 申请公布日期 2000.08.04
申请号 JP19990015598 申请日期 1999.01.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IWAOKA KAZUO;KATO SHINICHI
分类号 H05K9/00;C23C14/14;C23C14/20;(IPC1-7):H05K9/00 主分类号 H05K9/00
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