| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the rising amount of a solder fillet on a lead cutting surface at mounting of a product. SOLUTION: With the corner part on a lead cut punch pass side provided with a curvature R-clear part 9, an external lead 2 sandwiched between a lead cut punch 8 and a die 6 is not cut immediately, when it is clamped between the corner part of an external lead clamping/pressing surface 6a of the die 6 and a tooth tip 8a of the lead cur punch 8, raised upwardly by a curvature radial (dimension) of the clear part 9. The external lead 2 is sandwiched between the lead cut punch 8 and the die 6 along the arc part of the clear part 9 and cut, when it is bent. Thus, a solder plate is made to be present at the lead cut surface 2a by an amount equal to the curvature R-clear part 9 provided at the die 6.</p> |
