| 摘要 |
PROBLEM TO BE SOLVED: To prevent flux, etc., from degenerating and prevent it from polluting the periphery of a flux application device, by enabling flux or the like to be applied stably even on fine metallic balls 150 μm or under in diameter. SOLUTION: In this method, metallic ball arrangement of sucking metallic balls 3 in the metallic ball suction holes 6 of a metallic ball arrangement jig 1, and next, applying flux 8 or the like on the sucked metallic balls 3, and further, mounting metallic balls 3 en block on the target 3 of arrangement, are performed. In this case, at a flux supply plate 5, flux supply holes 7 are arranged in the positions corresponding to the metallic ball suction holes 6 of the metallic ball arrangement jig 1, and the flux supply holes 7 are filled with flux or the like by supplying flux or the like 8 from the rear 15 of the flux supply plate 5, and next the flux 8 or the like is applied on the surface of the metallic balls 3 by bringing the metalloc balls 3 sucked in the metallic ball suction holes 6 into contact with the flux supply holes 7. |
