| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method, wherein dielectric strength and adhesive strength with high reliability are secured where after an electronic component is soldered to a printed board, they are resin-sealed while flux residue is left as is without cleaning. SOLUTION: In a method for manufacturing a resin-sealing type printed circuit board, wherein an electronic part is mounted on a printed board by soldering, and their surrounding area is resin-sealed, the electronic part is, in a soldering process for the electronic component, reflow-soldered onto the printed board (a glass epoxy laminated board is suitable) with the use of cream solder comprising epoxy flux, wherein comprising epoxy resin as the main component, dicarboxylic acid (activator) is compounded with it, then the surrounding region of the printed board and the electronic part is sealed with epoxy resin, while flux residue left as is without being cleaned. Thereby excess dicarboxylic acid remaining in the flux residue is consumed by reacting it with a sealing resin (the epoxy resin), so that there is no need for cleaning the flux residue.
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