SEMICONDUCTOR PRESSURE SENSOR

摘要

PROBLEM TO BE SOLVED: To securely simplify the assembling process and to improve the reliability sufficiently even if a constituent member containing lead is not used. SOLUTION: The semiconductor pressure sensor is used while bonded with a stem 12 after a pressure sensor element part composed of a 1st silicon substrate 1 and a 2nd silicon substrate 2 is bonded with an insulating substrate 4. The sensor is provided with a base layer 11 for connection made of a material having one surface bonded well with the insulating substrate 4, and the other surface bonded well with a bonding material 17 made of a solder material containing no lead. The bonding material 17 is heated and molten to bond the insulating substrate 4 with the stem 12.