| 摘要 |
PROBLEM TO BE SOLVED: To protect a bonding wire against bonding failures and disconnection when a wedge bonding operation is carried out by a method wherein a bonding wire is insulated and covered with resin whose glass transition temperature is lower than a specific value, melting point is higher than a specific temperature, modulus of elasticity is smaller than a specific value, and coefficient of extension is larger than a specific value. SOLUTION: A bonding tool 1 has a structure where the angle of an inside chamber is set at 125 deg. to 180 deg., and a boundary A between the inside chamber and a smooth base is rounded. A sire bonding operation is carried out by the use of the bonding tool 1 and an insulated/covered bonding wire, where the bonding wire is coated with resin whose glass transition temperature is lower than 120 deg.C, melting point is higher than 130 deg.C, modulus of elasticity is lower than 200 kg/mm2, and coefficient of extension is above 10%. By this setup, a bonding wire can be protected against bonding failures and disconnection when a wedge bonding operation is carried out. |
