| 摘要 |
PROBLEM TO BE SOLVED: To realize easy mass production, cost reduction and miniaturization of a semiconductor device by enabling simultaneous assembly of a substrate having a plurality of body parts and a wafer having semiconductor elements formed therein and corresponding in number to the body parts. SOLUTION: The manufacturing method includes steps of mating bump electrodes 4 of semiconductor elements on a wafer 1 with inner pads 9 on a substrate 7, connecting the mated electrodes 4 and inner pads 9 together, injecting and filling resin 12 through a plurality of resin injection holes 10 in cut lines of the substrate 7, setting the resin 12, and cutting the substrate 7 and wafer 1 along the cut lines of the substrate 7 and along scribe lines of the wafer 1 at a time. |
