| 摘要 |
PROBLEM TO BE SOLVED: To properly bond a semiconductor pellet and a lead frame substrate with use of solder. SOLUTION: In this method, prior to placement of a lead frame substrate in a pellet bonding stage 4, concentrations of H2 and O2 gases are measured in a forming gas within the pellet bonding stage 4. In this case, pellet bonding is carried out only when the H2 gas concentration is between 17 and 20% and the O2 gas concentration is 150 ppm or less. In the semiconductor device, a void rate in a solder joint part is set to be 3% or less. |
