| 摘要 |
PROBLEM TO BE SOLVED: To see that the end face of wiring is not exposed to the flank of a semiconductor device. SOLUTION: This method includes a first step of preparing a tape carrier 40 where a plurality of through holes 28 are made and a plurality of electrically independent wirings 22 passing, on one side, above the through holes 28 are made, a second step of applying electroless plating to the wiring 22, a third step of mounting a semiconductor chip 10 to the tape carrier 40, with its face down, and covering the surface, side, and head face of the wiring 22, and a fourth step of striking the tape carrier 40 in the position excluding the wiring 22 outside the semiconductor chip 10. |
