| 摘要 |
PROBLEM TO BE SOLVED: To provide an integrated circuit device in which electrical connection can be made within the device itself by extending an electrically conductive bias from the bottom surface to the top surface of the device substrate and separating the walls of the electrically conductive bias from the device substrate by an electrical insulator. SOLUTION: An electric insulator 9 is formed on the upper surface 5 of a substrate 1 and in a trench and after a device substrate 13 is insulated by the insulator 9, an electrically conductive material layer 11 is formed in the trench on the insulator 9. The electrically conductive material layer 11 is then planarized and excess trench is removed until the insulator 9 is exposed. Subsequently, the bottom surface 7 is planarized to expose the electrically conductive material layer 11 as an electrically conductive bias. More specifically, the electrically conductive bias extends from the bottom surface to the top surface of the device substrate 13 and the walls of the electrically conductive bias are separated from the device substrate 13 by the electrical insulator 9. Consequently, electrical connection can be made within the device itself. |
