| 摘要 |
PROBLEM TO BE SOLVED: To easily and surely bend an electronic component positioning lead. SOLUTION: A stopper surface 13, to which and end surface 6a where an external lead 7 of an enclosure 6 provided at a lead frame, is drawn contacts, a support surface 14 which, inclined downward from the stopper surface 13, receives the enclosure 6, and a guide surface 15 inclined in a direction opposite to the support surface 14, supports a positioning lead 8 drawn from the enclosure 6 on the side opposite to the end surface 6a, are provided on a support stage 10. With a simple operations, wherein the positioning lead 8 is engaged with the guide surface 15 so that a pressurizing member 11 pressurizes the enclosure 6 to the support surface 14, the positioning lead 8 is bent to a specified angle with the guide surface 15. |
