| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method by which a multilayered wiring board having a low resistance can be manufactured easily. SOLUTION: A multilayered ceramic wiring board is manufactured in such a way that wiring layers 2A and 2B are formed on a transfer sheet 30 having an adhesive surface 30a which foams and loses its adhesive property when heated and, after the wiring layers 2A and 2B are stuck to green ceramic sheets 10A and 10B, the transfer sheet 30 is stripped off from the wiring layers 2A and 2B by lowering the adhesive property of the adhesive surface 30a through heat treatment. Then, after a desired number of green sheets 10A and 10B carrying wiring patterns 2A and 2B is laminated upon another, a restraining sheet is laminated upon both or one surface of the laminated body. Finally, the laminated green sheet body is baked and the restraining sheet is removed. |
