发明名称 MULTILAYER PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To reduce an electromagnetic-wave noise in a remote field which is radiated from a multilayer printed circuit board, by forming in its power- supply layer slits comprising non-conductor patterns having curved shapes, and by radiating radially from the slits the electromagnetic wave noises. SOLUTION: A multilayer printed board 1 is formed out of power-supply, ground, and signal layers, and in the power-supply layer or ground layer 2 of the multilayer printed board 1, non-conductor patterns comprising slits 7a of curved shapes are formed radially from its center portion in its longitudinal and lateral directions. Then, directions 5b of electromagnetic-wave noises 6b radiated from the respective constituent surfaces of each of such slits 7a are so made vertical to the tangential lines of the respective constituent surfaces as to radiate radially the electromagnetic-wave noises 6b. As a result, since the opposite parallel linear components to each other of the electromagnetic- wave noises are reduced between end surfaces 4a, 4b of the power-supply or ground layer 2, the electromagnetic-wave noises generated by their resonances can be reduced.
申请公布号 JP2000216586(A) 申请公布日期 2000.08.04
申请号 JP19990017008 申请日期 1999.01.26
申请人 HITACHI LTD 发明人 INUDOU KOUSUKE;KAMISAKA KOICHI;SUGA TAKU
分类号 H05K9/00;H05K3/46;(IPC1-7):H05K9/00 主分类号 H05K9/00
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