| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated board having bottomed via hole to which soldering can be performed without trouble even to its via hole and which can be manufactured easily. SOLUTION: A bottomed via hole is formed by forming a recess into an interlayer insulating layer 3 until a first layer 2 is partially exposed and a second layer 4. Then the via hole is filled up with carbon paste 7. After hardening and flattening the paste 7, a plated covering layer 8 which covers the second layer 4 and carbon paste 7 is formed by electroless plating and electroplating. |
