| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface-mounting type electronic components which can be soldered securely without interference between a soldering iron and other elements and is applicable to highly dense mounting, even if the electronic components are subjected to soldering by using the soldering iron. SOLUTION: A recessed part 2 (notched part) is formed in the peripheral part of a substrate 2, and a connection terminal 3 is provided adjacent to the recessed part 2. The connection terminal 3 is arranged, so that a part (one end face) of the outer circumferential surface of the connection terminal 3 and the end face (end face on the bottom side of the recessed part) of the recessed part 2a of the substrate 2 are substantially flush with each other. This manufacturing method is applied to a hybrid IC 10, where an element 1 is mounted to the substrate 2.
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