| 摘要 |
PROBLEM TO BE SOLVED: To protect holes of a conductive board, without using a hole filling ink to avoid the influence of the land width of the holes by heating to melt and applying a hot melt type positive type resist on the conductive board or between thin wire circuit patterns of the conductive board. SOLUTION: A hot melt type positive type photosensitive resin compsn. is heated to melt and applied on a conductive board with holes, or a resist layer is further formed on the conductive board, exposed like a desired pattern to an active ray and developed, the resist film on the exposed parts is removed, the exposed conductive film is removed by etching, and the remaining resist film is removed, as required. Or, a pattern of solder resist layer is further formed on the board with the conductive film pattern, exposed like a desired pattern to an active ray and developed, and the resist film on the exposed parts is removed. |
