| 摘要 |
PROBLEM TO BE SOLVED: To make a transparent plate unnecessary, eliminate exposure failure in an inner connection part of BGA type wiring, make conductor for connection hard to be oxidized, improve reliability, and enable miniaturization and reduction of weight and cost. SOLUTION: A photo detecting or light emitting semiconductor element 12 is mounted on one surface of a BGA type wiring board 11. Each of the electrodes of the semiconductor element 12 is connected with a corresponding inner connection part 16 of the BGA type wiring by using conductor 19. By molding, the semiconductor element 12, each conductor 19, and the vicinity of the connection part of the conductor 19 are resin-sealed with transparent plastic, and a transparent plastic package part 27 is formed on one surface of the BGA type wiring board 11. |
