| 摘要 |
PROBLEM TO BE SOLVED: To realize a manufacturing method of a light emitting diode chip with a lens which can obtain high working efficiency without needing skill. SOLUTION: In a semiconductor wafer, many sections for light emitting diode chips are arranged by using photolithography in a lens material arranging process (photosensitive resin coating process 34, exposure process 38 and development process). On light emitting regions in the many sections for light emitting regions on one surface of the wafer, photosensitive resin turning to the material of dome type lenses is arranged. In a heat treating process 42, the photosensitive resin arranged by the arranging process 46 is transformed to dome shapes by heat treatment. On the light emitting regions in the respective sections for light emitting diode chips, dome type lenses are formed at a time. As compared with the case that light emitting diode chips divided from a semiconductor wafer are individually formed into semispherical members, skill is not required, and high workability and massproductivity can be obtained. |
