| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor pressure sensor which has high reliability by preventing a pedestal from cracking owing to a heat shrinkage of solder. SOLUTION: A semiconductor substrate 1 which has a diaphragm 11 and a pedestal where a pressure intake 21 for introducing pressure to the diaphragm 11 is formed are bonded together, the opposite surface of the pedestal from the surface joined with the semiconductor substrate 1 and a die 31 of a package 3 are joined together to constitute the semiconductor sensor. The package 3 has a recess 22 for storing the pedestal 2 and is provided with the die 31 on the bottom surface, and the pedestal 2 is embedded in the recess 22 so that the external surface of the pedestal 2, the internal surface of the recess 34 of the package 3, the bottom surface of the pedestal 2, and the top surface of the die 31 abut, and the pedestal 2 is fixed to the package 3 by a stopper. Consequently, the pedestal 2 and the die 31 of the package 3 are bonded together.
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