| 摘要 |
PROBLEM TO BE SOLVED: To uniformize display quality, to improve directivity, brightness, and manufacturing efficiency of a display by forming a recessed part for arrangement of luminescent elements on a surface of a circuit board, and applying a prescribed rounding process to the outer periphery of the upper part or the outer periphery of the bottom part of the recessed part. SOLUTION: A plurality of recessed parts 5 for arrangement of luminescent elements are formed in a surface of a circuit board 2, and the luminescent elements are arranged in these recessed parts 5. The luminescent element is constituted with a chip-shaped LED element, and a given number of, here two elements are arranged in the recessed part 5. A translucent resin 7, such as an epoxy resin is charged into the recessed part 5 so as to cover the luminescent element. For enhancing directivity, the resin 7 for covering has a projecting lens shape suitable for collecting light outputted from the luminescent element and projects by an extent of 1 mm from the surface of the circuit board 2. By rounding the corner of the outer periphery of the upper part and the outer periphery of the bottom part, reduction of bubbles that mix into the resin 7 or degassing of injected bubbles is accelerated.
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