MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide an apparatus for manufacturing a lead-on-chip(LOC) type package for die bonding with use of a liquid or paste-like adhesive. SOLUTION: A bonding stage 1 has a chip mounting surface 2 and a lead frame abutment surface 3. The lead frame abutment surface 3 surrounds the chip mounting surface 2 and is higher in positional level than the chip mounting surface 2. Vacuum suction holes 4 and 5 are made in the chip mounting surface 2 and lead frame abutment surface 3 respectively. A pilot pin 6 to be fitted into position restriction hole in a lead frame is provided on the lead frame abutment surface 3. Setting of height positions between the surfaces 2 and 3 enables an interval between a semiconductor chip and the lead frame to be easily kept within its allowable range.