INTEGRATED CIRCUIT DEVICE CONTAINING LOW DISPERSION CAPACITIVE CIRCUIT NETWORK

摘要

PROBLEM TO BE SOLVED: To reduce the difference of offsets between the actual value and the nominal value of capacity generated between integrated circuit devices by connecting first and second terminals having conduction electrodes whose number is similar to conduction layers constituting the integrated circuit device to conduction electrodes forming both ends of laminated layers. SOLUTION: An integrated circuit contains a first capacitive element CF and the capacitive element CF forms a capacitor having a nominal fixed value between a first terminal TC1 and a second terminal. The first capacitive terminal CF is formed of the laminated layers of conduction layers 1-6 which are cut from conduction layers and it is electrically insulated from the conduction layers. The first capacitive element CF has the conduction electrodes whose number is similar to the conduction layers 1-6 constituting the integrated circuit. The first terminal TC1 and the second terminal of the first capacitive element CF are connected to the conduction electrodes 1 and 6 forming both the ends of the laminated layers. Since all the conduction layers are used for forming the first capacitive element CF, the number of manufacture processes becomes the largest.