Chip electronic component and manufacturing method thereof

摘要

A chip inductor element (20') is formed to have an outer package through a step of press-fitting the chip inductor element (20') into a component storage section (31) of a desired chip outer shape in mold plate (33) comprised of a heat resistance rubber elastic member (32) including the component storage section (31) while a resin coating material (14) coated on the element (20') is in a dry to touch state, the element (20') together with the mold plate (33), thereby hardening the resin coating material (14) and automatically shaping the element (20') into a chip inductor (30) having a desired outer shape (rectangular parallelopiped shape).