| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin-based interlaminar insulated adhesive which does not contain a halogen, exhibits flame retardancy, has excellent heat resistance and excellent storage stability, and can quickly be cured at a high temperature of >=100 deg.C. SOLUTION: This interlaminar insulated adhesive for multi-layer printed circuit boards contains the following components (a) to (c) as essential components. (a) A phosphorous compound of the formula (R1, R2 are each an alkyl group or an aromatic group). (b) A multi-functional epoxy resin having three or more glycidyl groups. (c) A bisphenol type epoxy resin having a weight- average mol.wt. of 20,000 to 100,000. The component (a) is added in an amount of 1.5-10 wt.% (as the content of phosphorus) based on the solid content of the resin constituting the interlaminar insulated adhesive. |
