发明名称 |
RESIN MOLDED PRODUCT |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin molded product obtained by molding a melamine resin composition containing a melamine resin and a filler with slight elution. SOLUTION: In this resin molded product 1, elution of formalin from the molded product 1 is interrupted by an inorganic coating film layer 2 by forming the inorganic coating film layer 2 on the surface of the molded product 1 obtained by molding a melamine resin composition by using a silicone-based inorganic coating material, etc.
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申请公布号 |
JP2000212314(A) |
申请公布日期 |
2000.08.02 |
申请号 |
JP19990016091 |
申请日期 |
1999.01.25 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
NAGAOKA ATSUSHI;KUBOTA SHIZUKA |
分类号 |
C08J7/04;C09D1/00;C09D161/28;C09D183/04;(IPC1-7):C08J7/04 |
主分类号 |
C08J7/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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