发明名称 RESIN MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a resin molded product obtained by molding a melamine resin composition containing a melamine resin and a filler with slight elution. SOLUTION: In this resin molded product 1, elution of formalin from the molded product 1 is interrupted by an inorganic coating film layer 2 by forming the inorganic coating film layer 2 on the surface of the molded product 1 obtained by molding a melamine resin composition by using a silicone-based inorganic coating material, etc.
申请公布号 JP2000212314(A) 申请公布日期 2000.08.02
申请号 JP19990016091 申请日期 1999.01.25
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NAGAOKA ATSUSHI;KUBOTA SHIZUKA
分类号 C08J7/04;C09D1/00;C09D161/28;C09D183/04;(IPC1-7):C08J7/04 主分类号 C08J7/04
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