发明名称 |
Thick-film paste with insoluble additive |
摘要 |
<p>A thick-film paste for printing thick-film circuit elements, including solder stops (20), conductors (12), resistors and capacitors, and a method for using the paste. The paste has a composition that includes an organic vehicle, a filler material that contributes the desired electrical and/or material properties to the thick film fired from the paste, and an additive that is insoluble in the organic vehicle and contributes pseudoplastic rheological properties to the paste during printing. The additive also preferably evaporates, burns off, sublimates or is otherwise removed below the firing temperature of the paste.</p> |
申请公布号 |
EP1024533(A2) |
申请公布日期 |
2000.08.02 |
申请号 |
EP19990204411 |
申请日期 |
1999.12.20 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
LAUTZENHISER, FRANS PETER;BERLIN, CARL WILLIAM;CARTER, BRADLEY HOWARD;SARMA, DWADASI HARE RAMA;ISENBERG, JOHN KARL |
分类号 |
H01L21/56;H01L23/498;H05K1/09;(IPC1-7):H01L23/498 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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