| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition which is excellent in quick curability and storage stability and gives a thermally cured item excellent in resistances to water and heat by compounding an epoxy resin with a phenol- resin-based curing agent and an N-benzylpiperazine compound (salt). SOLUTION: This composition contains an epoxy resin preferably having an m.p. of 50-120 deg.C and containing, on average, at least two epoxy groups per molecule, a phenol-resin-based curing agent preferably having an m.p. of 50-120 deg.C and containing, on average, at least two phenolic hydroxyl groups per molecule, and an N-benzylpiperazine compound (or its salt) represented by the formula. In the formula, R1 and R2 are each H, a 1-4C alkyl, or a 1-4C alkoxy. Preferably, the counter anion of the N-benzylpiperazine salt of the formula is an organic acid (e.g. succinic, trimellitic, or phthalic acid) or a tetrasubstituted organic borate (e.g. tetraphenyl borate). The composition is useful as a material for electronic parts, lminate boards, or the like.
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