发明名称 FLEXIBLE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a flexible structure with improved safety and a cooling and heating function by placing a flexible composition body with heat conductivity between a surface material and a heating and cooling body and bringing the surface material into thermal contact with the heating and cooling body. SOLUTION: The surface material is constituted of, for instance, polyvinyl chloride resin, polyurethane resin, or one whose surface is coated by such resin. The flexible structure 3 is composed of, for instance, a flexible insulating material 6 such as foam resin, felt, etc., and a heat conductive material 7 such as a metal or an inorganic substance with electric conductivity and is formed by bringing a heating and cooling body 4 into thermal contact with the surface material 2. The heat conductivity of the flexible composition 3 is generated by combining the flexible insulating material 6 and the heat conductive material 7 or mechanically mixing them. A Peltier element is used as the heating and cooling body 4. Thus the flexible structure 1 with cushioning properties and heating and cooling function by transmitting heat and cold of the heating and cooling body can be obtained.
申请公布号 JP2000210227(A) 申请公布日期 2000.08.02
申请号 JP19990018354 申请日期 1999.01.27
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ISHII TAKAHITO;KAWASE SHIGEKI
分类号 A47K13/00;(IPC1-7):A47K13/00 主分类号 A47K13/00
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