Via connections in wafer bonded structures

摘要

The invention includes an integrated circuit device comprising a device substrate 1 having a top and bottom surface, wherein the device substrate comprises an electrically conductive via 11, wherein the electrically conductive via extends from the bottom surface to the top surface of the device substrate and wherein the walls of the electrically conductive via are separated from the device substrate by an electrical insulator 9. The integrated circuit device is bonded to a support substrate 13 and the device substrate 1 is etched back I to expose the via conductor structure.