| 摘要 |
PROBLEM TO BE SOLVED: To obtain a solid imaging device whose imaging unit can be miniaturized and which enables the hard tip end part of an endoscope etc., to be thinned and shortened. SOLUTION: An imaging unit is made so as to be constituted of an unpackaged solid imaging chip 18 and a circuit board 20 which is connected to the backside of the solid imaging chip 18 and mounted with an electronic part 19. A box shape board is constituted so that the circuit board 20 comprising a film shape board is folded with respect to the board main part 26 and a conductor pattern and a terminal part are positioned at the inner face side. A bonding pad disposed on the solid imaging chip 18 and a bonding pad 33 disposed on the circuit board 20 are electrically connected by a connecting means 36 comprising a bonding wire or a film on which wiring pattern is formed. The electronic part 19 is mounted on the inner face of the box shape board. A signal cable 35 is connected to a terminal part 34 and the circuit board 20 is made housed within the projected area of the solid imaging chip 18.
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