| 摘要 |
PROBLEM TO BE SOLVED: To provide excellent adhesion with a metal vapor depositing layer, on the surface of aluminum foil, by forming a metal vapor depositing layer with nuclei under plasma discharge and forming a metal vapor depositing layer thereon. SOLUTION: Preferably, the plasma discharge intensity is controlled to >=6.7 W.min./m2, discharge gas in the plasma discharge is composed of oxygen, and both metals in the metal vapor depositing layer with nuclei under plasma discharge and the metal vapor depositing layer are composed of copper. Desirably, the average film thickness of the metal vapor depositing layer with nuclei is >=0.01 nm, and the average film thickness of the metal vapor depositing layer is 5 to 150 nm. The aluminum foil is stuck foil obtd. by sticking the opposite face of the metal vapor depositing face of the aluminum foil with a plastic sheet or a plastic film, coated foil obtd. by coating the opposite face of the metal vapor depositing face of the aluminum foil with a polymer or colored foil or printed foil obtd. by coloring or printing the opposite face of the metal vapor depositing face in the aluminum foil, and its thickness is preferably controlled to 6 to 200μm.
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