发明名称 LEAD FRAME WORKING DIE FOR IC
摘要 PROBLEM TO BE SOLVED: To provide a lead frame working die capable of instantly coping with changing of a kind of lead frames. SOLUTION: A die is provided with upper die/lower die standard parts 3, 4 usable regardless of a kind of lead frames F and upper/lower die reassembling parts 5, 6 to be reassembled corresponding to a kind of the lead frames. The lower die reassembling part 6 is provided with a guide rail 60 for guiding the lead frame, a die 61 to directly work the lead frame F, a die plate 62 to mount the die 61 and a die backing 63 for connecting/placing the die plate 62, and the upper die reassembling part 5 is provided with a punch 51 corresponding to the die 61, a punch plate 50 for mounting the punch 51 and a stripper 53.
申请公布号 JP2000210730(A) 申请公布日期 2000.08.02
申请号 JP19990012519 申请日期 1999.01.20
申请人 FUJII SEIKO KK 发明人 NAGAMITSU YASUHIRO;HAMAHARA TSUTOMU
分类号 B21D28/00;B21D28/14;B21D37/02;H01L23/50;(IPC1-7):B21D28/14 主分类号 B21D28/00
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