发明名称 ADHESIVE PUTTY
摘要 PROBLEM TO BE SOLVED: To provide an adhesive putty, allowing a reser to handle it directly with his hand because of its non-adhesivity, adhesive to an object under heating at a relatively low temperature without needing to coat the object with an adhesive primer beforehand, and excellent in processability, adhesion, and resistance to weather and heat. SOLUTION: This adhesive putty is essentially composed of (A) 100 pts.wt. of an organopolysiloxane having at least one vinyl group in the molecule and degree of polymerization of 1,000 to 20,000, (B) 1 to 1,000 pts.wt. of a filler, (C) 0.1 to 15 pts. wt. of a siloxane shown by the formula [R1,R2 and R3 are each a 1-6C monovalent hydrocarbon or H; and (a), (b) and (n) are numbers of 1 to 10, 1 to 100 and 1 to 4, respectively]. It may contain (E) 0.1 to 10 pts.wt. of an azo-based polymerization initiator having a decomposition point of 80 to 130 deg.C per 100 pts.wt. of the component A.
申请公布号 JP2000212542(A) 申请公布日期 2000.08.02
申请号 JP19990019026 申请日期 1999.01.27
申请人 GE TOSHIBA SILICONES CO LTD 发明人 SAWADA MAKOTO
分类号 C09J11/04;C09J11/06;C09J183/04;(IPC1-7):C09J183/04 主分类号 C09J11/04
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