RESIN COMPOSITION FOR ELECTRONIC PART SEALING, ITS PRODUCTION, AND SEALED ELECTRONIC PART USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for electronic part sealing of a thermoplastic resin with excellent humidity resistance reliability and moldability. SOLUTION: This resin composition comprises (A) a linear chain polyarylene sulfide resin, (B) an inorganic ion exchanger, (C) a molten kneaded product of (a) at least one olefin copolymer selected from a copolymer consisting of anα-olefin and anα,β-unsaturated acid glycidyl ester and another copolymer consisting of anα-olefin and anα,β-unsaturated acid alkyl ester, and (b) a copolymer composed of ethylene, anα-olefin of at least 3C and a non-conjugated diene, and (D) an inorganic filler.