发明名称 ARCHITECTURAL MATERIAL
摘要 PROBLEM TO BE SOLVED: To promote execution efficiency and, at the same time, to easily recovering a place be damaged. SOLUTION: A mold releasing layer 8 is formed on the surface of a substrate layer 1. An adhesion material 3 or an absorption material 4 capable of being horizontally slid and being absorbed and adhered when it is pressure-contacted are provided to the rear side of a surface layer material 2. A fitting projection 10 and a fitting recess 11 are formed on the surface layer material 2. The absorption material 4 is, for example, a micro-sucker absorption material making a synthetic resin foam body of closed bubbles as a tape-shape as an outline cross section is shown, a large number of opened recesses of the closed bubbles as the sucker are formed on the surface of the tape, and with an adhesive material on the rear side is adhered to the surface layer material 2.
申请公布号 JP2000213146(A) 申请公布日期 2000.08.02
申请号 JP19990017100 申请日期 1999.01.26
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 KAMEYAMA NORITOSHI;USUI HIROAKI;KONISHI SATORU;MINAMI KOJI;WATANABE TSUTOMU;ADACHI ARIHIRO;TSUKAMOTO MASASUKE
分类号 E04F15/00;E04F15/02;(IPC1-7):E04F15/00 主分类号 E04F15/00
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