发明名称 CONDUCTIVE LAMINATED FILM, CONDUCTIVE LAMINATED SEAMLESS BELT, AND IMAGE FORMATION DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain a laminated film which has a low tensile elongation, is excellent in electric resistance, flexural resistance, or the like, and can be easily produced by laminating a highly conductive metal layer having a high tensile modulus to a conductive resin film. SOLUTION: This conductive laminated film at least comprises a layer (A) mainly comprising a resin and having a volume resistivity of 100-1014Ω.cm and a metal layer (B). Preferably, layer A contains a thermoplastic resin and a conductive component. A general-purpose resin can be used as the thermoplastic resin. A known conductive filler or conductive agent can be used as the conductive component. Preferably, the thickness of layer A is 10-300μm. Aluminum and copper are especially favorable for layer B, and its thickness is preferably 1-200μm. Preferably, the conductive laminate film further has a layer (C) containing a conductive pressure-sensitive adhesive. Layer C has a function to bond layer A to layer B.
申请公布号 JP2000212297(A) 申请公布日期 2000.08.02
申请号 JP19990014155 申请日期 1999.01.22
申请人 MITSUBISHI CHEMICALS CORP 发明人 SAKOGAWA KOUICHI;NISHIKAWA MANABU;WATANABE AKIRA
分类号 C08J5/18;B32B15/08;C08K3/04;C08L67/02;C08L69/00;C09J7/02;C09J9/02;C09J201/00;G03G5/10;G03G15/16;G03G21/00;(IPC1-7):C08J5/18 主分类号 C08J5/18
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