| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in resistance to soldering heat, reliability of moisture resistance, fluidity, and mechanical properties by incorporating an epoxy resin containing a biphenyl epoxy compound as the essential ingredient, a curing agent containing a phenol-alkylbenzene-aldehyde resin as the essential ingredient, and a filler into the same. SOLUTION: The epoxy resin contains an epoxy compound of formula I as the essential ingredient. The curing agent contains, as the essential ingredient, a phenol-alkylbenzene-aldehyde resin which is prepared by reacting an alkylbenzene of formula III with an aldehyde of the formula: R3-CHO in the presence of an acid catalyst and reacting the resultant resin (P) with a phenol (Z) of formula IV in a wt. ratio satisfying 1<=Z/P<=20 in the presence of an acid catalyst and then with an aromatic aldehyde (Y) in a molar ratio satisfying 0.1<=Y/Z<=1. In the formulas, OG is a group of formula II; R1 is H or the like; R2 is a 1-8C alkyl or the like: (m) is 1-4; R3 is H or the like; R4 is H or the like; (n) is 1-3: and R5 is H or the like.
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