| 摘要 |
PROBLEM TO BE SOLVED: To provide a reactive hot melt adhesive composition which can be cured by the irradiation of active energy rays, has a small melt viscosity, exhibits excellent heat resistance after cured, and does not require a special production installation, a special packaging material, etc., and to provide a method for adhering with the composition. SOLUTION: This reactive hot melt adhesive composition comprises a polyester which has a number-average mol.wt. of 500-6,000 and a viscosity of <=10,000 ps at 100 deg.C and contains aliphatic hydroxyl groups, an epoxy compound such as a bisphenol type epoxy resin having a number-average mol.wt. of 600-5,000, and a cationic polymerization initiator which can polymerize the composition by the irradiation of active energy rays, such as at least one of aromatic iodonium complexes, sulfonium complexes or metallocene salts. The method for adhering comprises thermally melting the composition, coating adherends with the melted composition, laminating the adherends to each other, irradiating the coated composition with active energy rays, and then pressing the adherends each other.
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