| 摘要 |
PROBLEM TO BE SOLVED: To obtain a conductive adhesive which can easily be peeled, can give high reliability to bonded portions of the and is circuit useful for chip parts, etc., and even whose residues can easily be removed with an ordinary solvent, by compounding an epoxy resin, a curing agent, conductive particles and a saturated copolyester resin as essential components. SOLUTION: This conductive adhesive comprises (A) an epoxy resin such as a phenol type epoxy resin preferably in an amount of 100 pts.wt., (B) a curing agent such as an aliphatic polyamine preferably in an amount of 0.1-30 pts.wt., (C) conductive particles such as silver (alloy) particles preferably in an amount of 30-2,000 pts.wt., and (D) a saturated copolyester resin, for example, obtained by the polycondensation of a dicarboxylic acid component such as terephthalic acid or adipic acid with a diol component such as ethylene glycol or neopentyl glycol preferably in an amount of 30-200 pts.wt., as essential components.
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