| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition suitable for sealing a semiconductor having excellent moldability and package crack resistance by compounding a stilbene type epoxy resin with an novolak type epoxy resin, phenol, a curing promoter and an inorganic filler as essential components. SOLUTION: This epoxy resin composition is obtained by compounding 10-100 pts.wt. of one or more stilbene type epoxy resins of the formula (R1 to R10 are each 1-6C alkyl, phenyl, H or a halogen) with 100 pts.wt. of a novolak type epoxy resin having 40-50 deg.C melting point, a phenol resin such as a phenol novolak resin in an equivalent ratio of the epoxy group of the whole epoxy resins to phenolic hydroxyl group of the whole phenyl resin of 0.5-2 and a curing promoter such as triphenyl phosphite and an inorganic filler such as spherical fused silica powder in an amount of 20-2,400 pts.wt. based on 100 pts.wt. of the total amount of the whole epoxy resins and the whole phenol resin as essential components.
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