| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing an optical semiconductor excellent in transparency, adhesiveness, moisture proof reliability and molding flash releasability by compounding an epoxy resin, a curing agent, a specific mold releasing agent and a specific curing accelerator. SOLUTION: This epoxy resin composition is prepared by compounding an epoxy resin e.g. bisphenol A type epoxy resin, a curing agent such as a novolak type phenol resin or the like, a mold releasing agent comprising a >=18C ethoxy compound, preferably an ethoxy compound of a primary alcohol shown by formula I (A is 17-100; B is a positive integer) and a curing accelerator comprising at least either one of a compound shown by formula II [R1 is H, methyl, isopropyl, t-butyl or the like; R2 is H, benzyl, (cyano)methyl, (cyano)ethyl or the like; R4 and R5 are each H, (hydroxy)methyl or the like] or formula III [R6 and R7 are each H, (hydroxy)methyl or the like].
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