SEMICONDUCTOR WAFER PROTECTION TACKY SHEET AND GRINDING METHOD OF SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To obtain a tacky sheet for protecting a semiconductor wafer to prevent warping of the wafer in a back grinding process. SOLUTION: This tacky sheet is a tacky sheet for protecting a semiconductor wafer composed of a substrate film and a tacky agent layer having >=0.6 GPa tensile elastic modulus of the substrate film. The tacky sheet is composed of a substrate film and a tacky agent layer and the substrate film may be composed of a multilayer film containing at least one layer of a film layer having >=0.6 GPa tensile elastic modulus. Further, the tacky film is composed of the substrate film and the tacky agent layer and a product of the tensile elastic modulus (GPa) and the thickness (mm) of the substrate film may be >=0.02 (GPa.mm).